ATTO10-S High Vacuum Magnetron Sputtering Coating Machine

Suitable for most R & D applications magnetron sputtering sources. Indirect cooling, clamping target design, integrated anode shielding assembly, self-adjusting height. Suitable for low and medium power, R & D and small-scale producstetion applications. These sputtering cathodes range in size from one to four inches, can use any material, have excellent target utilization, and can be driven by RF, DC or pulsed DC power supplies.



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ATTO10-S High Vacuum Magnetron Sputtering Coating Machine

Features:

Multi-station glove box purification protection system

Water oxygen content

Germany Baode solenoid valve modular design, excellent sealing performance

European process requirements

Wide pressure range to 10 -9 Torr

Low exhaust

Excellent film uniformity and deposition rate

Efficient sputtering target utilization

Excellent target management mechanism eliminates the need for thermal paste, management staff, etc.

Compact, modular magnet array

Magnet is not exposed to vacuum, magnet is not exposed to cooling water

During target replacement, the cooling water will not be exposed to the vacuum chamber

Unbalanced operation and compatibility with magnetic materials are available

Full range of accessories (ventilation, chimney, shutters, cluster array, etc.)

Custom sputtering source configuration available

Technical Parameter 

Vacuum coating system 

Description 

Material: Stainless steel 1.4301 (SUS type 304), thickness 5mm, all welding seams are connected by argon arc automatic welding technology; mirror polished inner surface, three treatments on outer surface.

Size: 400mm × 400mm × 450mm; 157" × 157"  × 177"

Volume0.072m³
Observation window 

The door is equipped with a glass observation window (including anti-pollution baffle), which is convenient for observing the working situation at work.

Conform to the national standard of X-ray protection

Extra vacuum 

≤6. 67x10-5pa (2×10-7Torr) (after baking and degassing)

Vacuum recovery time 

≤6.67X10-4 pa(after baking and degassing)

Interface Three standard interfaces (φ200), expand the installation of molecular pumps and plug-in valves;
Four standard interfaces (CF35) are reserved for extended functions;
Illumination LED lighting is located on the side of the vacuum chamber for easy observation
Leak rate 

The leak detection shall be carried out according to GB T 32218-2015, and the final acceptance test shall be conducted according to the standard of ≤1x10-10PaL / s.

Vacuum system 
Description 

Using "molecular pump + mechanical pump" high vacuum system:

Molecular pump 

Pumping speed: 1200L / S, a true quasi-oil-free vacuum system, using down-pumping to avoid the pumping weakness of the molecular pump and improve the pumping speed; the molecular pump is guaranteed for 5 years and provides direct replacement service for damage.

  * Optional imported molecular pump

Vacuum pump 

Specifications: Rotary vane vacuum pump, equipped with oil mist filter, with gas ballast control

Flow rate: 36 m³ / h (21 cfm), double substrate, vacuum -3 mbar or dry pump (optional)

* Optional dry vacuum pump

Operating voltage AC 230 V / 50-60 Hz, 10 A or AC 115 V / 50-60 Hz, 20 A (optional)
Pumping speed 

 Pumping from the atmosphere to 9×10-4Pa≤30min(exposure to the atmosphere for a short time, flushing with dry nitrogen and starting pumping)

Valve 

Main valve: CC-200, high-vacuum electric linkage plug-in valve;

Front stage valve / bypass valve: GDQ-40 high vacuum pneumatic baffle valve;

Vacuum measurement 

"Two low and one high" (two resistance gauges measure low vacuum and one ionization gauge measure high vacuum) Digital display compound vacuum gauge, measuring range from 1 × 105Pa to 1 × 10-5Pa; displayed and controlled by PC Operation interlocking linkage.

* Optional imported wide range vacuum transmitter

Vacuum measurement 

Part adopts metal seal, part adopts fluorine rubber ring seal;

Substrate stage 
Description The sample table is made of 304 stainless steel, the substrate is placed directly above the evaporation source (full automatic lifting function), and the tooling is designed according to the size of the substrate to facilitate the user to fix the sample. Customizable high-precision etching mask plate;
SpinThe stepping motor is used to control the rotation, the magnetic fluid is sealed, the motor and the magnetic fluid are coaxial, and there will be no loss of rotation or crawling. The stepper motor is accurately controlled and the speed range is 0-30rpm continuously adjustable
LiftAdopt stepper motor to control rotation, magnetic fluid seal, precise control, height range 0-100mm continuously adjustable;
MaskDrawer-type structure, carrying the largest sample less than 120 × 120mm, equipped with Japanese SMC pneumatic substrate baffle, electric linkage automatic control.

Coating source

2 "permanent magnetron sputtering target

                (Target size diameter 50.8mm)


Structure 

Centripetal sputtering, the distance between the magnetron target and the sample is adjustable from 90 to 140mm, each target has good water cooling and DC / RF / MF compatibility

Electric control baffle assembly: 1 set

Equipped with shielding cover to avoid cross contamination between targets (installation and use when non-co-sputtering);

Can be folded to the center of the sample above, the distance between the target and the sample is adjustable;

Number 

3 sets 

Radio frequency (RF) sputtering power supply

Power

0~600W

ControlRadio frequency (RF) sputtering power supply

Number

1 set 

DC sputtering power supply

Output power 

0-1000W

Control RS-485 interface, the power supply is continuously adjustable between 0-maximum power.

Number 

1 set 

DC bias power supply

Description 

0~1000W

Control RS-485 interface, the power supply is continuously adjustable between 0-maximum power.

Number

1 set 


Ion fast currentAbove 1A
Rapid flow area30 degree half angle 

Number 

1 set 

Gas path system

Description 

Process gas, argon (50sccm), oxygen (20sccm) gas mass flow control and display each way.

Control PID intelligent control, equipped with corresponding stop valve and pipeline, etc.

Number 

2 path


Crucible

Cold crucible between beams 0-500ma, direct cold crucible 0-1a

The capacity of the crucible is 6-hole intercooling 4 × 17ml, 6-hole direct cooling 4 × 22ml, annular direct cooling 85ml

The positioning of crucible (four hole crucible) is controlled automatically or manually

Water inlet temperature of crucible cooling water ≤ 25 ℃, water inlet pressure ≥ 0.2MPa, water flow ≥ 8L / min

Number 

1 set 

Control system
Description With windows operation platform, cotrl2000 control system and IPC + network technology, the parameterization setting of main parts of the whole machine, real-time monitoring, fault intelligent diagnosis and automatic monitoring of film thickness are realized. There are two modes of automatic and manual control. In addition to taking lofting products, other operation processes are all controlled by software on PC; friendly man-machine operation interfaces such as vacuum system, process setting, gas filling and discharging system are provided; parameters can be set by formula on industrial computer to realize setting, storage and printing of program process and equipment parameters.
Specifications 

It can effectively solve the accuracy, stability and reliability of coating.

Perfect program interlock, complete anti misoperation design and protection; system water shortage, over flow pressure and other abnormal conditions alarm and implement corresponding protection measures.

Rich I / O interface design is adopted to fully meet the functional requirements of expansion and external connected equipment.

The display controls the door opening / closing of the coater.

Coating process, process, film thickness, convenient and save printing.

Film thickness monitoring and control system

Description The quartz crystal diaphragm thickness controller is used, and the water-cooled diaphragm thickness probe is installed near the substrate platform and connected with the industrial computer. The film thickness meter is used to monitor the coating rate and final thickness in real time with an accuracy of ± 1a (0.1nm). The real-time information is fed back to the industrial computer. If the coating reaches the set thickness, it can automatically control the power supply, stop coating and realize the purpose of automatic film thickness control.
Range Monitoring thickness range: 1 Å ~ 99 μ 9999 Å, resolution: 1 Å

Feature 

The coating process, process and film thickness are all set on PC, which can realize the automatic control of the whole process. The coating process can be set on PC and the data can be recorded.

Water cooling system 

Description 

The cooling water circuit is 8 in and 8 out, and the main water inlet is controlled by water pressure relay.

The total water inlet and outlet are connected to 1p refrigeration cycle water machine, with the temperature control range of 10 – 25 ℃. Provide stable cooling water for target, metal source, molecular pump and magnetic fluid to ensure stable operation of equipment.

Optional equipment 

Substrate stage Heating The special armored heating wire is used to avoid the problems of traditional heating elements polluting the vacuum chamber, polluting the substrate, short life and requiring frequent maintenance. The heating temperature is: room temperature ~ 300 ℃, temperature control adopts imported PID intelligent temperature controller of Japan island power, with temperature control accuracy of ± 1 ℃.
Water cooling Step motor is used to control driving rotation, dynamic sealing, one in one out water flow.
Liquid nitrogen cooling Patented products: use stepping motor to control drive rotation, magnetic fluid seal, motor and magnetic fluid coaxial, measured temperature - 160 ℃

Film select coating 

Patented products: optional film coating, automatic transfer and alignment, adjustable deposition height.
Automatic coordination coatingPatented product: stepless selection and coating function, automatic transfer and alignment of return to zero and return, adjustable deposition height
Stepless turning and rotationPatented products: realize horizontal and vertical rotation of substrate, stepless rotation and heating, and realize high uniformity coating.
3 "permanent magnetron sputtering target (target size d76.2mm)Centripetal sputtering, the distance between the magnetron target and the sample is 90-110mm adjustable, with good water cooling and DC / RF / MF compatibility
2 "strong magnetron sputtering target (target size d56.8mm)Centripetal sputtering, the distance between the magnetron target and the sample is 90-110mm adjustable, with good water cooling and DC / RF / MF compatibility
3 "strong magnetron sputtering target (target size d76.2mm)Centripetal sputtering, the distance between the magnetron target and the sample is 90-110mm adjustable, with good water cooling and DC / RF / MF compatibility
RF switchThe shift gear function of 1-switch-2 is designed (i.e. one set of power supply can be used for two sets of magnetron sputtering targets at different times). Generally, other parameters of power supply other than power setting need not be adjusted before and after shifting.

Vacuum baking / degassing

Double heater design;

Power: 1200 W;

Mounting flange: cf35;

Fast degassing of vacuum chamber to improve vacuum degree;

The baking time is shorter than oven and heating belt;

Sampling chamber 

Door opening structure, size: about Φ 200 x 300mm

Vacuum system: mechanical pump, molecular pump, valve

Limit vacuum: ≤ 6.67x10-4 PA (after baking and degassing).

Vacuum recovery time: 6.6x10-3 PA in 30 minutes (the system is exposed to the atmosphere for a short time and charged with dry nitrogen)

Chamber heatingThe vacuum chamber is equipped with a heating system with a temperature of 200 ℃ and a temperature control of ± 1 ℃
Water cooling system 

The cooling water circuit is 8 in and 8 out, and the main water inlet is controlled by water pressure relay.

The total water inlet and outlet are connected to 1p refrigeration cycle water machine, with the temperature control range of 10 – 25 ℃. Provide stable cooling water for metal source, molecular pump and magnetic fluid to ensure stable operation of the equipment.

Optional instructions 
Product certification 

ISO9001 certification、CE certification、UL certification

Application considerationsPlease refer to the danger, warning, caution and other clauses in the manual for details