Among various sputtering coating technologies, magnetron sputtering technology is one of the most important technologies. In order to prepare large-area and uniform thin films with consistent batches, the target base distance is optimized, the substrate movement mode is changed, and the film thickness is implemented. Monitoring and other measures. Multi-station magnetron sputtering coating equipment has been paid more and more attention and used because of its adjustable speed ratio and simultaneous production of multiple substrates, which greatly improves the efficiency.

In the actual coating, sometimes the target material is not suitable for opening holes in the middle, and for the stone-controlled sputtering system, the method of improving the uniformity of the film thickness by changing the target shape in actual production is not feasible. Therefore, it is very necessary and important to find a feasible method that can improve the uniformity of the film thickness.

Provide a multi-functional magnetron sputtering coating system, which is integrated by a vacuum coating system and a glove box system, which can complete thin film evaporation in a high vacuum evaporation chamber, and under a high purity inert gas atmosphere in the glove box. Carry out the storage and preparation of samples and the detection of samples after evaporation. The combination of evaporation coating and glove box realizes the fully enclosed production of evaporation, packaging, testing and other processes, so that the entire film growth and device preparation process is highly integrated in a complete controllable environment atmosphere system, eliminating the organic large-area circuit preparation process. The influence of unstable factors in the atmospheric environment guarantees the preparation of high-performance, large-area organic optoelectronic devices and circuits.

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